| Mechanical | Specification |
| Insertion/Extraction Force | 4.0 oz [114 gms] nominal |
| Retention Force | 5.0 lbs [22.2N] nominal |
| Durability (EIA 364-9C) | Up to 100,000 Cycles |
| Operating Temperature | -65°C to 125°C | Wire Size for Crimp & Solder Cup |
| 16 - 20 AWG | Mechanical Shock (EIA 364-27B) |
| 50Gs, No discontinuities >1 microsec. | Random Vibration (EIA 364-28D) cond Vl, Ltr I |
| 19.64Gs, No discontinuties >1 microsec. | |
| Electrical | Specification |
| Resistance (LLCR-EIA 364-23B) | < 2 milliohms |
| Current Rating | 12 Amp nominal (dependent upon mounting config., contact density, ambient temp, etc.) |
| Materials | Specification |
| Contact Wires | Beryllium Copper, 50μ inch of gold plating over nickel |
| Sleeve | High conductivity copper alloy, 10μ inch gold plating over nickel |
| Spring Clip | Beryllium Copper, not plated |
| Termination | High conductivity copper alloy, 50μ inch gold plating over nickel |
All specifications subject to change without notice. All dimensions are in [mm]. US Patent No. 6,767,260