Mechanical | Specification |
Durability (EIA 364-9C) | Up to 100,000 Cycles, <2 milliohm change |
Operating Temperature | -65°C to 125°C | Wire Size for Crimp & Solder Cup |
22 - 26 AWG | |
Electrical | Specification |
Resistance (LLCR-EIA 364-23B) | < 8 milliohms |
Current Rating | 2.5 Amp nominal for 30°C T∆ with 22 AWG wiring |
Materials | Specification |
Mating Pin | Brass, 50μ inch gold plating over nickel |
Spring Clip | Beryllium Copper, not plated |
All specifications subject to change without notice. All dimensions are in [mm]. US Patent No. 6,767,260 & 7,775,841