| Mechanical | Specification |
| Insertion/Extraction Force | 3.0 oz [85 gms] nominal |
| Retention Force | 5.0 lbs [22.2N] nominal |
| Durability (EIA 364-9C) | Up to 100,000 Cycles, <2 milliohm change |
| Operating Temperature | -65°C to 125°C |
| Wire Size for Crimp & Solder Cup | 22 - 26 AWG |
| Mechanical Shock (EIA 364-27B) | 500g no damage, no discontinuities >10 nanosec. |
| Random Vibration (EIA 364-28D) cond Vl, Ltr I | 43.92g no damage, no discontinuties >10 nanosec. |
| Electrical | Specification |
| Resistance (LLCR-EIA 364-23B) | < 7 milliohms |
| Current Rating | 3.0 Amp nominal for 30°C ∆T with 22 AWG wiring |
| Materials | Specification |
| Contact Wires | Beryllium Copper, 50μ inch of gold plating over nickel |
| Sleeve | Stainless Steel |
| Termination | Brass, 10μ inch gold plating over nickel |
| Spring clip | Beryllium Copper, not plated |
All specifications subject to change without notice. All dimensions are in [mm]. US Patent No. 6,767,260 & 7,775,841