| Mechanical | IDO2 Specification | Test Procedure |
| Connector Mating Force | 3.5 lbs. max. | EIA-364, TP 13 |
| Connector Retention Force | 20.0 lbs. min. | EIA-364, TP 90 |
| Contact Retention Force | 5.0 lbs. min. per contact | EIA-364, TP 29 |
| Connector Mating Cycles | 10,000 min. | EIA-364, TP 9 |
| Random Vibration | 19.64 G (root mean square) | EIA-364, TP 28; Test Condition V; Mil-Std-1344, Method 2005 |
| Mechanical Shock | 50 G | EIA-364, TP 20; Mil-Std-1344, Method 3001 |
| Electrical |
| Current Rating | See contact pattern | EIA-364, TP 70 |
| Low Level Contact Resistance | See contact pattern | EIA-364, TP 23; Mil-Std-1344, Method 3002 |
| Insulation Resistance | > 10,000 MΩ | EIA-364, TP 21; Mil-Std-1344, Method 3003 |
| Dielectric Withstanding Voltage | See contact pattern | EIA-364, TP 20; Mil-Std-1344, Method 3001 |
| Environment |
| Protection Index | IP50 | IEC 60529 |
| Operating Temperature | -40°C to 85°C |
| Materials |
| Connector | |
| Molded Parts (except as indicated below) | Polycarbonate (PC) |
| Cable Clamp | Polyethersulfone (PES) |
| Bend Relief | Thermoplastic Elastomer (TPE) |
| Mounting Nut | Die Cast Zinc with Nickel Plating |
| Contacts | |
| Contact Wires & Spring Clips | Beryllium Copper |
| All other parts | High Conductivity Copper Alloys |
| Contact Plating |
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